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1. general description the 74CBTLV1G125 is a high-performance, low-power, low-voltage, si-gate cmos device, superior to most advanced cmos compatible ttl families. schmitt trigger action at control input makes the circuit tolerant to slower input rise and fall times across the entire v cc range from 2.3 v to 3.6 v. this device is fully speci?ed for partial power-down applications using i off . the i off circuitry disables the output, preventing the damaging back?ow current through the device when it is powered down. the 74CBTLV1G125 provides a single high-speed line switch. the switch is disabled when the output enable ( oe) input is high. to ensure the high-impedance off-state during power up or power down, oe should be tied to the v cc through a pullup resistor. the minimum value of the resistor is determined by the current-sinking capability of the driver. 2. features n supply voltage range from 2.3 v to 3.6 v n high noise immunity n complies with jedec standard: u jesd8-5 (2.3 v to 2.7 v) u jesd8-b/jesd36 (2.7 v to 3.6 v) n esd protection: u hbm jesd22-a114-d exceeds 2000 v u mm jesd22-a115-a exceeds 200 v u cdm jesd22-c101-c exceeds 1000 v n 5 w switch connection between two ports n rail to rail switching on data i/o ports n cmos low power consumption n latch-up performance meets requirements of jesd78 class i n i off circuitry provides partial power down mode operation n multiple package options n speci?ed from - 40 cto+85 c and - 40 c to +125 c 74CBTLV1G125 single bus switch rev. 01 23 february 2007 product data sheet
74CBTLV1G125_1 ? nxp b.v. 2007. all rights reserved. product data sheet rev. 01 23 february 2007 2 of 18 nxp semiconductors 74CBTLV1G125 single bus switch 3. ordering information 4. marking 5. functional diagram table 1. ordering information type number package temperature range name description version 74CBTLV1G125gw - 40 c to +125 c tssop5 plastic thin shrink small outline package; 5 leads; body width 1.25 mm sot353-1 74CBTLV1G125gv - 40 c to +125 c sc-74a plastic surface-mounted package; 5 leads sot753 74CBTLV1G125gm - 40 c to +125 c xson6 plastic extremely thin small outline package; no leads; 6 terminals; body 1 1.45 0.5 mm sot886 74CBTLV1G125gf - 40 c to +125 c xson6 plastic extremely thin small outline package; no leads; 6 terminals; body 1 1 0.5 mm sot891 table 2. marking type number marking code 74CBTLV1G125gw bm 74CBTLV1G125gv b25 74CBTLV1G125gm bm 74CBTLV1G125gf bm fig 1. logic symbol fig 2. logic diagram 001aad713 a oe b 4 2 1 switch 001aad714 ab oe
74CBTLV1G125_1 ? nxp b.v. 2007. all rights reserved. product data sheet rev. 01 23 february 2007 3 of 18 nxp semiconductors 74CBTLV1G125 single bus switch 6. pinning information 6.1 pinning 6.2 pin description 7. functional description 7.1 function table [1] h = high voltage level; l = low voltage level. fig 3. pin con?guration sot353-1 and sot753 fig 4. pin con?guration sot886 fig 5. pin con?guration sot891 74CBTLV1G125 oe v cc a gnd b 001aad715 1 2 3 5 4 74CBTLV1G125 a 001aad717 oe gnd n.c. v cc b transparent top view 2 3 1 5 4 6 74CBTLV1G125 a 001aaf817 oe gnd n.c. v cc b transparent top view 2 3 1 5 4 6 table 3. pin description symbol pin description sot353-1/sot753 sot886/sot891 oe 1 1 output enable input oe (active low) a 2 2 data input or output a gnd 3 3 ground (0 v) b 4 4 data input or output b n.c. - 5 not connected v cc 5 6 supply voltage table 4. function table [1] output enable input oe function switch l on-state h off-state
74CBTLV1G125_1 ? nxp b.v. 2007. all rights reserved. product data sheet rev. 01 23 february 2007 4 of 18 nxp semiconductors 74CBTLV1G125 single bus switch 8. limiting values [1] the minimum input and output voltage ratings may be exceeded if the input and output current ratings are observed. [2] for tssop5 and sc-74a packages: above 87.5 c the value of p tot derates linearly with 4.0 mw/k. for xson6 packages: above 45 c the value of p tot derates linearly with 2.4 mw/k. 9. recommended operating conditions [1] applies to control signal levels. 10. static characteristics table 5. limiting values in accordance with the absolute maximum rating system (iec 60134). voltages are referenced to gnd (ground = 0 v). symbol parameter conditions min max unit v cc supply voltage - 0.5 +4.6 v v i input voltage [1] - 0.5 +4.6 v v sw switch voltage enable and disable mode - 0.5 v cc + 0.5 v i ik input clamping current v i/o < - 0.5 v - - 50 ma i sk switch clamping current v i < - 0.5 v or v i >v cc + 0.5 v - 50 ma i sw switch current v sw = 0 v to v cc - 128 ma i cc supply current - 50 ma i gnd ground current - 50 - ma t stg storage temperature - 65 + 150 c p tot total power dissipation t amb = - 40 c to +125 c [2] - 250 mw table 6. recommended operating conditions symbol parameter conditions min typ max unit v cc supply voltage 2.3 - 3.6 v v i input voltage 0 - 3.6 v v sw switch voltage enable and disable mode 0 - v cc v t amb ambient temperature - 40 - +125 c d t/ d v input transition rise and fall rate v cc = 2.3 v to 3.6 v [1] 0 - 20 ns/v table 7. static characteristics at recommended operating conditions; voltages are referenced to gnd (ground = 0 v). symbol parameter conditions min typ [1] max unit t amb = - 40 c to +85 c v ih high-level input voltage v cc = 2.3 v to 2.7 v 1.7 - - v v cc = 2.7 v to 3.6 v 2.0 - - v v il low-level input voltage v cc = 2.3 v to 2.7 v - - 0.7 v v cc = 2.7 v to 3.6 v - - 0.8 v i i input leakage current v i = gnd to v cc ; v cc = 3.6 v - - 1.0 m a i s(off) off-state leakage current v i =v ih or v il ; v o =v cc - gnd; v cc = 3.6 v; see figure 6 - 0.1 5 m a i s(on) on-state leakage current v i =v ih or v il ; v cc = 3.6 v; see figure 7 - 0.1 5 m a
74CBTLV1G125_1 ? nxp b.v. 2007. all rights reserved. product data sheet rev. 01 23 february 2007 5 of 18 nxp semiconductors 74CBTLV1G125 single bus switch [1] typical values are measured at t amb =25 c and at v cc = 3.3 v. [2] one input at 3 v, other inputs at v cc or gnd. [1] typical values are measured at t amb =25 c. [2] measured by the voltage drop between the a and b terminals at the indicated current through the switch. on-state resistance is determined by the lower of the voltages of the two (a or b) terminals. i off power-off leakage current v i or v o = 0 v to 3.6 v; v cc = 0 v - - 10 m a i cc supply current v i = gnd or v cc ; i o = 0 a; v cc = 3.6 v - - 10 m a d i cc additional supply current control input; v i =v cc - 0.6 v; v cc = 3.6 v [2] - - 300 m a c i input capacitance control input; v i = 0 v or 3 v - 2.5 - pf c sw switch capacitance off-state - 7.0 - pf on-state - 10.3 - pf t amb = - 40 c to +125 c v ih high-level input voltage v cc = 2.3 v to 2.7 v 1.7 - - v v cc = 2.7 v to 3.6 v 2.0 - - v v il low-level input voltage v cc = 2.3 v to 2.7 v - - 0.7 v v cc = 2.7 v to 3.6 v - - 0.8 v i i input leakage current v i = gnd to v cc ; v cc = 3.6 v - - 100 m a i s(off) off-state leakage current v i =v ih or v il ; v o =v cc - gnd; v cc = 3.6 v; see figure 6 -- 200 m a i s(on) on-state leakage current v i =v ih or v il ; v cc = 3.6 v; see figure 7 -- 200 m a i off power-off leakage current v i or v o = 0 v to 3.6 v; v cc = 0 v - - 10 m a i cc supply current v i = gnd or v cc ; i o = 0 a; v cc = 3.6 v - - 200 m a d i cc additional supply current control input; v i =v cc - 0.6 v; v cc = 3.6 v [2] - - 5000 m a table 7. static characteristics continued at recommended operating conditions; voltages are referenced to gnd (ground = 0 v). symbol parameter conditions min typ [1] max unit table 8. resistance r on at recommended operating conditions; voltages are referenced to gnd (ground = 0 v); see test circuit figure 8 . symbol parameter conditions - 40 c to +85 c - 40 c to +125 c unit min typ [1] max min max r on on resistance v cc = 2.3 v; see figure 9 [2] i sw = 64 ma; v i = 0 v - 4.7 10 - 15.0 w i sw = 24 ma; v i = 0 v - 4.5 10 - 15.0 w i sw = 15 ma; v i = 1.7 v - 11 25 - 38.0 w v cc = 3.0 v; see figure 10 i sw = 64 ma; v i = 0 v - 4.2 7 - 11.0 w i sw = 24 ma; v i = 0 v - 4.1 7 - 11.0 w i sw = 15 ma; v i = 2.4 v - 7.3 15 - 25.5 w
74CBTLV1G125_1 ? nxp b.v. 2007. all rights reserved. product data sheet rev. 01 23 february 2007 6 of 18 nxp semiconductors 74CBTLV1G125 single bus switch fig 6. test circuit for measuring off-state leakage current fig 7. test circuit for measuring on-state leakage current 001aad716 i s i s v cc v ih a oe b v i v o gnd 001aad718 i s v cc v il a oe b n.c. v i gnd r on =v sw /i sw . fig 8. test circuit for measuring on-resistance 001aad729 a b v i gnd v cc v il oe v sw i sw
74CBTLV1G125_1 ? nxp b.v. 2007. all rights reserved. product data sheet rev. 01 23 february 2007 7 of 18 nxp semiconductors 74CBTLV1G125 single bus switch (1) t amb = 125 c (2) t amb =85 c (3) t amb =25 c (4) t amb = - 40 c (1) t amb = 125 c (2) t amb =85 c (3) t amb =25 c (4) t amb = - 40 c a. v cc = 2.5 v; i sw = 15 ma; v sw = 1.7 v b. v cc = 2.5 v; i sw = 24 ma; v sw =0 v (1) t amb = 125 c (2) t amb =85 c (3) t amb =25 c (4) t amb = - 40 c c. v cc = 2.5 v; i sw = 64 ma; v sw =0 v fig 9. switch on-resistance as a function of input voltage at v cc = 2.5 v 001aad732 v sw (v) 03 2 1 8 4 12 16 r on ( w ) 0 (1) (2) (3) (4) 001aad733 v sw (v) 03 2 1 8 4 12 16 r on ( w ) 0 (1) (2) (3) (4) 001aad734 v sw (v) 03 2 1 6 10 14 r on ( w ) 2 (1) (2) (3) (4)
74CBTLV1G125_1 ? nxp b.v. 2007. all rights reserved. product data sheet rev. 01 23 february 2007 8 of 18 nxp semiconductors 74CBTLV1G125 single bus switch (1) t amb = 125 c (2) t amb =85 c (3) t amb =25 c (4) t amb = - 40 c (1) t amb = 125 c (2) t amb =85 c (3) t amb =25 c (4) t amb = - 40 c a. v cc = 3.3 v; i sw = 15 ma; v sw = 2.4 v b. v cc = 3.3 v; i sw = 24 ma; v sw =0 v (1) t amb = 125 c (2) t amb =85 c (3) t amb =25 c (4) t amb = - 40 c c. v cc = 3.3 v; i sw = 64 ma; v sw =0 v fig 10. switch on-resistance as a function of input voltage at v cc = 3.3 v 001aad737 v sw (v) 04 3 12 7 5 9 11 r on ( w ) 3 (1) (2) (3) (4) 001aad736 v sw (v) 04 3 12 7 5 9 11 r on ( w ) 3 (1) (2) (3) (4) 001aad735 v sw (v) 04 3 12 6 4 8 10 r on ( w ) 2 (1) (2) (3) (4)
74CBTLV1G125_1 ? nxp b.v. 2007. all rights reserved. product data sheet rev. 01 23 february 2007 9 of 18 nxp semiconductors 74CBTLV1G125 single bus switch 11. dynamic characteristics [1] all typical values are measured at t amb =25 c and at nominal v cc . [2] the propagation delay is the calculated rc time constant of the maximum on-state resistance of the switch and the load capac itance, when driven by an ideal voltage source (zero output impedance). [3] t pd is the same as t plh and t phl . [4] t en is the same as t pzh and t pzl . [5] t dis is the same as t phz and t plz . 12. waveforms table 9. dynamic characteristics gnd = 0 v; see figure 13 . symbol parameter conditions - 40 c to +85 c - 40 c to +125 c unit min typ [1] max min max t pd propagation delay a to b or b to a; see figure 11 ; r l = w [2] [3] v cc = 2.3 v to 2.7 v - - 0.21 - 0.32 ns v cc = 3.0 v to 3.6 v - 0.16 0.25 - 0.39 ns t en enable time oe to a or b; see figure 12 ; r l = 500 w [4] v cc = 2.3 v to 2.7 v 1.0 2.50 4.00 1.0 5.00 ns v cc = 3.0 v to 3.6 v 1.0 2.05 4.00 1.0 5.00 ns t dis disable time oe to a or b; see figure 12 ; r l = 500 w [5] v cc = 2.3 v to 2.7 v 1.0 2.80 5.00 1.0 6.30 ns v cc = 3.0 v to 3.6 v 1.0 3.40 4.10 1.0 5.40 ns measurement points are given in t ab le 10 . logic levels: v ol and v oh are typical output voltage drop that occur with the output load. fig 11. the data input (a or b) to output (b or a) propagation delays 001aad719 a or b input b or a output v m v i gnd v oh v ol v m t plh t phl v m v m table 10. measurement points supply voltage output inputs v cc v m v m v i t r = t f 2.3 v to 3.6 v 0.5 v cc 0.5 v cc v cc 2.0 ns
74CBTLV1G125_1 ? nxp b.v. 2007. all rights reserved. product data sheet rev. 01 23 february 2007 10 of 18 nxp semiconductors 74CBTLV1G125 single bus switch measurement points are given in t ab le 11 . logic levels: v ol and v oh are typical output voltage drop that occur with the output load. fig 12. enable and disable times 001aad720 t pzl t pzh t phz t plz gnd gnd v i v cc v ol v oh v m v m v m v x v y switch disabled switch enabled switch enabled output low-to-off off-to-low output high-to-off off-to-high oe input a or b a or b table 11. measurement points supply voltage input output v cc v m v m v x v y 2.3 v to 2.7 v 0.5 v cc 0.5 v cc v ol + 0.15 v v oh - 0.15 v 3.0 v to 3.6 v 0.5 v cc 0.5 v cc v ol + 0.3 v v oh - 0.3 v
74CBTLV1G125_1 ? nxp b.v. 2007. all rights reserved. product data sheet rev. 01 23 february 2007 11 of 18 nxp semiconductors 74CBTLV1G125 single bus switch test data is given in t ab le 12 . de?nitions for test circuit: r l = load resistance. c l = load capacitance including jig and probe capacitance. r t = termination resistance should be equal to the output impedance z o of the pulse generator. v ext = test voltage for switching times. fig 13. load circuitry for switching times v ext v cc v i v o mna616 dut c l r t r l r l pulse generator table 12. test data supply voltage load v ext v cc c l t plh , t phl t pzh , t phz t pzl , t plz 2.3 v to 2.7 v 30 pf open gnd 2 v cc 3.0 v to 3.6 v 50 pf open gnd 2 v cc
74CBTLV1G125_1 ? nxp b.v. 2007. all rights reserved. product data sheet rev. 01 23 february 2007 12 of 18 nxp semiconductors 74CBTLV1G125 single bus switch 13. package outline fig 14. package outline sot353-1 (tssop5) unit a 1 a max. a 2 a 3 b p l h e l p wy v ce d (1) e (1) z (1) q references outline version european projection issue date iec jedec jeita mm 0.1 0 1.0 0.8 0.30 0.15 0.25 0.08 2.25 1.85 1.35 1.15 0.65 e 1 1.3 2.25 2.0 0.60 0.15 7 0 0.1 0.1 0.3 0.425 dimensions (mm are the original dimensions) note 1. plastic or metal protrusions of 0.15 mm maximum per side are not included. 0.46 0.21 sot353-1 mo-203 sc-88a 00-09-01 03-02-19 w m b p d z e e 1 0.15 13 5 4 q a a 2 a 1 l p (a 3 ) detail x l h e e c v m a x a y 1.5 3 mm 0 scale tssop5: plastic thin shrink small outline package; 5 leads; body width 1.25 mm sot353-1 1.1
74CBTLV1G125_1 ? nxp b.v. 2007. all rights reserved. product data sheet rev. 01 23 february 2007 13 of 18 nxp semiconductors 74CBTLV1G125 single bus switch fig 15. package outline sot753 references outline version european projection issue date iec jedec jeita sot753 sc-74a wb m b p d e a a 1 l p q detail x h e e v m a a b y 0 1 2 mm scale c x 13 2 4 5 plastic surface-mounted package; 5 leads sot753 unit a 1 b p cd e h e l p qy w v mm 0.100 0.013 0.40 0.25 3.1 2.7 0.26 0.10 1.7 1.3 e 0.95 3.0 2.5 0.2 0.1 0.2 dimensions (mm are the original dimensions) 0.6 0.2 0.33 0.23 a 1.1 0.9 02-04-16 06-03-16
74CBTLV1G125_1 ? nxp b.v. 2007. all rights reserved. product data sheet rev. 01 23 february 2007 14 of 18 nxp semiconductors 74CBTLV1G125 single bus switch fig 16. package outline sot886 (xson6) terminal 1 index area references outline version european projection issue date iec jedec jeita sot886 mo-252 sot886 04-07-15 04-07-22 dimensions (mm are the original dimensions) xson6: plastic extremely thin small outline package; no leads; 6 terminals; body 1 x 1.45 x 0.5 mm d e e 1 e a 1 b l l 1 e 1 0 1 2 mm scale notes 1. including plating thickness. 2. can be visible in some manufacturing processes. unit mm 0.25 0.17 1.5 1.4 0.35 0.27 a 1 max b e 1.05 0.95 d ee 1 l 0.40 0.32 l 1 0.5 0.6 a (1) max 0.5 0.04 1 6 2 5 3 4 6 (2) 4 (2) a
74CBTLV1G125_1 ? nxp b.v. 2007. all rights reserved. product data sheet rev. 01 23 february 2007 15 of 18 nxp semiconductors 74CBTLV1G125 single bus switch fig 17. package outline sot891 (xson6) terminal 1 index area references outline version european projection issue date iec jedec jeita sot891 sot891 05-03-11 05-04-06 xson6: plastic extremely thin small outline package; no leads; 6 terminals; body 1 x 1 x 0.5 mm d e e 1 e a 1 b l l 1 e 1 0 1 2 mm scale dimensions (mm are the original dimensions) unit mm 0.20 0.12 1.05 0.95 0.35 0.27 a 1 max b e 1.05 0.95 d ee 1 l 0.40 0.32 l 1 0.35 0.55 a max 0.5 0.04 1 6 2 5 3 4 a
74CBTLV1G125_1 ? nxp b.v. 2007. all rights reserved. product data sheet rev. 01 23 february 2007 16 of 18 nxp semiconductors 74CBTLV1G125 single bus switch 14. abbreviations 15. revision history table 13. abbreviations acronym description cdm charged device model cmos complementary metal oxide semiconductor dut device under test esd electrostatic discharge hbm human body model mm machine model ttl transistor-transistor logic table 14. revision history document id release date data sheet status change notice supersedes 74CBTLV1G125_1 20070223 product data sheet - -
74CBTLV1G125_1 ? nxp b.v. 2007. all rights reserved. product data sheet rev. 01 23 february 2007 17 of 18 nxp semiconductors 74CBTLV1G125 single bus switch 16. legal information 16.1 data sheet status [1] please consult the most recently issued document before initiating or completing a design. [2] the term short data sheet is explained in section de?nitions. [3] the product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple dev ices. the latest product status information is available on the internet at url http://www .nxp .com . 16.2 de?nitions draft the document is a draft version only. the content is still under internal review and subject to formal approval, which may result in modi?cations or additions. nxp semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. short data sheet a short data sheet is an extract from a full data sheet with the same product type number(s) and title. a short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. for detailed and full information see the relevant full data sheet, which is available on request via the local nxp semiconductors sales of?ce. in case of any inconsistency or con?ict with the short data sheet, the full data sheet shall prevail. 16.3 disclaimers general information in this document is believed to be accurate and reliable. however, nxp semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. right to make changes nxp semiconductors reserves the right to make changes to information published in this document, including without limitation speci?cations and product descriptions, at any time and without notice. this document supersedes and replaces all information supplied prior to the publication hereof. suitability for use nxp semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of a nxp semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. nxp semiconductors accepts no liability for inclusion and/or use of nxp semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customers own risk. applications applications that are described herein for any of these products are for illustrative purposes only. nxp semiconductors makes no representation or warranty that such applications will be suitable for the speci?ed use without further testing or modi?cation. limiting values stress above one or more limiting values (as de?ned in the absolute maximum ratings system of iec 60134) may cause permanent damage to the device. limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the characteristics sections of this document is not implied. exposure to limiting values for extended periods may affect device reliability. terms and conditions of sale nxp semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www .nxp .com/pro? le/ter ms , including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by nxp semiconductors. in case of any inconsistency or con?ict between information in this document and such terms and conditions, the latter will prevail. no offer to sell or license nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. 16.4 trademarks notice: all referenced brands, product names, service names and trademarks are the property of their respective owners. 17. contact information for additional information, please visit: http://www .nxp.com for sales of?ce addresses, send an email to: salesad dresses@nxp.com document status [1] [2] product status [3] de?nition objective [short] data sheet development this document contains data from the objective speci?cation for product development. preliminary [short] data sheet quali?cation this document contains data from the preliminary speci?cation. product [short] data sheet production this document contains the product speci?cation.
nxp semiconductors 74CBTLV1G125 single bus switch ? nxp b.v. 2007. all rights reserved. for more information, please visit: http://www.nxp.com for sales office addresses, please send an email to: salesaddresses@nxp.com date of release: 23 february 2007 document identifier: 74CBTLV1G125_1 please be aware that important notices concerning this document and the product(s) described herein, have been included in section legal information. 18. contents 1 general description . . . . . . . . . . . . . . . . . . . . . . 1 2 features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 3 ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5 functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 6 pinning information . . . . . . . . . . . . . . . . . . . . . . 3 6.1 pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 6.2 pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 7 functional description . . . . . . . . . . . . . . . . . . . 3 7.1 function table . . . . . . . . . . . . . . . . . . . . . . . . . . 3 8 limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4 9 recommended operating conditions. . . . . . . . 4 10 static characteristics. . . . . . . . . . . . . . . . . . . . . 4 11 dynamic characteristics . . . . . . . . . . . . . . . . . . 9 12 waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 13 package outline . . . . . . . . . . . . . . . . . . . . . . . . 12 14 abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 16 15 revision history . . . . . . . . . . . . . . . . . . . . . . . . 16 16 legal information. . . . . . . . . . . . . . . . . . . . . . . 17 16.1 data sheet status . . . . . . . . . . . . . . . . . . . . . . 17 16.2 de?nitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 16.3 disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 16.4 trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 17 contact information. . . . . . . . . . . . . . . . . . . . . 17 18 contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

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